ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,749, issued on Aug. 19, was assigned to Tokyo Electron Ltd. (Tokyo).
"Bonding system and surface modification method" was invented by Yuji Mimura (Koshi, Japan), Hiroshi Maeda (Koshi, Japan), Takashi Terada (Koshi, Japan), Masaru Honda (Koshi, Japan), Ryoichi Sakamoto (Koshi, Japan) and Yutaka Yamasaki (Koshi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding system includes a surface modifying apparatus and a bonding apparatus. The surface modifying apparatus is configured to modify a bonding surface of a substrate to be bonded to another substrate with plasma of a processing gas. The bonding apparatus is configured to bond two substra...