US Patent Issued to Tokyo Electron on Aug. 12 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,385,132, issued on Aug. 12, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Ibuki Hayashi (Iwate, Japan), Yasushi Takeuchi (Iwate, Japan), Manabu Honma (Iwate, Japan) and Junnosuke Taguchi (Iwate, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes: a processing chamber; a rotary table rotatably provided inside the processing chamber; a stage that is rotatable relative to the rotary table at a position spaced apart from a rotation center of the rotary table; a process gas supplier provided above the rotary table; a separation gas supp...