ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,559, issued on April 8, was assigned to Tokyo Electron Ltd. (Tokyo).
"Oblique deposition and etch processes" was invented by Akiteru Ko (Albany, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a substrate that includes receiving a patterned photoresist formed over a substrate, the patterned photoresist defining initial openings, each of the initial openings including a first side and an opposite second side along a first direction; depositing a mask material preferentially on the first side within the initial openings using an oblique deposition process performed at a first angle inclined from the first side; and removing ...