US Patent Issued to Tokyo Electron on April 29 for "Substrate processing apparatus and substrate transfer position adjustment method" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,678, issued on April 29, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate transfer position adjustment method" was invented by Joji Takayoshi (Miyagi, Japan), Hidehiko Sato (Miyagi, Japan), Hiroshi Nagahata (Miyagi, Japan) and Yuri Kimura (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a process module that includes: a stage having a first surface on which a substrate is placed and a second surface, a process module including an edge ring placed on the second surface, a measurement unit measuring an etching rate of the substrate; and a controller. The co...