US Patent Issued to Tokyo Electron on April 29 for "Methods for retaining a processing liquid on a surface of a semiconductor substrate" (New York Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,698, issued on April 29, was assigned to Tokyo Electron Ltd. (Tokyo).

"Methods for retaining a processing liquid on a surface of a semiconductor substrate" was invented by Shan Hu (Albany, N.Y.) and Peter D'Elia (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Improved puddle processes and methods are provided herein for retaining a processing liquid on a surface of a semiconductor substrate. More specifically, improved methods are provided herein for retaining a puddle within a center region of a semiconductor substrate while the substrate is stationary, or rotating at relatively low rotational speeds. In the disclosed embodiments, a pud...