ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,671, issued on April 29, was assigned to Tokyo Electron Ltd. (Tokyo).
"Film deposition apparatus for fine pattern forming" was invented by Kazuhide Hasebe (Yamanashi, Japan), Shigeru Nakajima (Yamanashi, Japan), Jun Ogawa (Yamanashi, Japan) and Hiroki Murakami (Yamanashi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a mask pattern forming method, a resist film is formed over a thin film, the resist film is processed into resist patterns having a predetermined pitch by photolithography, slimming of the resist patterns is performed, and an oxide film is formed on the thin film and the resist patterns after an end of the slimming step in a fi...