US Patent Issued to Tokyo Electron on April 22 for "Substrate liquid processing apparatus for supplying temperature-controlled plating liquid" (Japanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,281,390, issued on April 22, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate liquid processing apparatus for supplying temperature-controlled plating liquid" was invented by Yuichiro Inatomi (Kumamoto, Japan) and Tomonori Esaki (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate liquid processing apparatus configured to supply a plating liquid to a substrate includes a substrate holder configured to hold the substrate; a plating liquid sending device configured to send the plating liquid to a first flow path; a temperature controller connected to the plating liquid sending device via the first flow path and configured to c...