US Patent Issued to Tokyo Electron on April 15 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,276,027, issued on April 15, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Katsuhiro Morikawa (Koshi, Japan), Masami Akimoto (Koshi, Japan), Mitsuaki Iwashita (Nirasaki, Japan) and Satoshi Kaneko (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a liquid processing module, provided with a carry-out/in opening of a substrate, including therein a first liquid processing device and a second liquid processing device; a module-outside transfer device configured to carry the substrate out from and into the liquid processing modul...