US Patent Issued to Tokyo Electron on April 15 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,276,455, issued on April 15, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Masataka Gosho (Kumamoto, Japan), Shu Yamamoto (Kumamoto, Japan), Tomohito Ura (Kumamoto, Japan) and Satoshi Okamura (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus for drying a substrate by substituting a liquid film of a drying liquid formed on the substrate with a supercritical fluid incudes: a pressure container configured to accommodate the substrate on which the liquid film is formed; a discharge line configured to discharge a fluid inside the pres...