ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,122, issued on April 15, was assigned to Tokyo Electron Ltd. (Tokyo).
"Heating device and heating method" was invented by Takashi Sugimoto (Yamanashi, Japan), Hiroyuki Takahashi (Yamanashi, Japan) and Shinya Okano (Yamanashi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heating device for heating a substrate is provided. The heating device comprises a support portion configured to support the substrate, and a light irradiation unit configured to heat the substrate by irradiating the substrate supported by the support portion with light. A plurality of zones are set in the light irradiation unit, and each of the plurality of zones set in the...