US Patent Issued to Tokyo Electron on April 1 for "Substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,264,396, issued on April 1, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method" was invented by Takashi Nakazawa (Kumamoto, Japan), Isamu Miyamoto (Kumamoto, Japan), Keigo Satake (Kumamoto, Japan) and Kenji Nakamizo (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first insta...