US Patent Issued to TOKYO ELECTRON Ltd. on Sept. 23 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,459, issued on Sept. 23, was assigned to TOKYO ELECTRON Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Hiroki Sakurai (Kumamoto, Japan), Yenrui Hsu (Kumamoto, Japan), Shoki Mizuguchi (Kumamoto, Japan), Nobuhiro Ogata (Kumamoto, Japan), Shinichi Umeno (Kumamoto, Japan), Kazuya Goda (Kumamoto, Japan), Minsung Kim (Kumamoto, Japan) and Hiroyuki Higashi (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus according to the present disclosure includes a substrate holding unit, a fluid supplying unit, a processing-liquid supplying unit, a nozzle, a fluid amount adj...