US Patent Issued to Tokuyama on July 29 for "Polycrystalline silicon lump, packaging body thereof, and method for producing same" (Japanese Inventor)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,371,237, issued on July 29, was assigned to Tokuyama Corp. (Yamaguchi, Japan).

"Polycrystalline silicon lump, packaging body thereof, and method for producing same" was invented by Manabu Sakida (Yamaguchi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polycrystalline silicon lump packaging body is a packaging body in which the resin bag is filled with the polycrystalline silicon lumps having a surface metal concentration of 1000 pptw or less, in which a nitrate ion amount and preferably a fluorine ion amount present inside the packaging body are each 50 Mug/L or less with respect to a filling void of the polycrystalline silicon lumps formed wh...