US Patent Issued to TOHOKU UNIVERSITY on Nov. 18 for "Low back pain analysis device, low back pain analysis method, and program" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,471,839, issued on Nov. 18, was assigned to TOHOKU UNIVERSITY (Sendai, Japan).

"Low back pain analysis device, low back pain analysis method, and program" was invented by Ziheng Wang (Sendai, Japan), Keizo Sato (Sendai, Japan) and Ryoichi Nagatomi (Sendai, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to an aspect of the invention, there is provided a low back pain analysis device comprising: a processor; and a storage medium having computer program instructions stored thereon, wherein the computer program instructions, when executed by the processor, perform processing of: obtaining a relationship between a result of a pattern and a lo...