US Patent Issued to TOHOKU UNIVERSITY on Nov. 11 for "Power semiconductor device and power semiconductor module each having electrodes on opposing surfaces of power semiconductor chip" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,825, issued on Nov. 11, was assigned to TOHOKU UNIVERSITY (Sendai, Japan).

"Power semiconductor device and power semiconductor module each having electrodes on opposing surfaces of power semiconductor chip" was invented by Yoshikazu Takahashi (Sendai, Japan) and Tetsuo Endoh (Sendai, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor device includes a power semiconductor chip and a fourth electrode. The power semiconductor chip has a first surface and a second surface opposite to each other and includes a first electrode and a second electrode on the first surface thereof, and a third electrode on the second surface thereof. ...