US Patent Issued to Tohoku University on Dec. 2 for "Positioning method, method for manufacturing layered body, positioning device, layered body manufacturing device, and layered body" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,485,604, issued on Dec. 2, was assigned to Tohoku University (Sendai, Japan).

"Positioning method, method for manufacturing layered body, positioning device, layered body manufacturing device, and layered body" was invented by Masaru Nakagawa (Sendai, Japan), Subaru Harada (Sendai, Japan) and Toshiaki Hayakawa (Sendai, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A positioning method includes a layering step of layering a first object and a second object, a detection step of detecting, after the layering step, a first signal obtained from a first array body of the first object, a second signal obtained from a second array body of the first object...