ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,818, issued on June 10, was assigned to TOHOKU-MICROTEC Co. LTD. (Sendai, Japan).
"Stacked semiconductor device" was invented by Makoto Motoyoshi (Sendai, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Stacked semiconductor device encompasses an upper semiconductor substrate, an upper insulating film laminated on a principal surface of the upper semiconductor substrate, an upper sealing-pattern orbiting along a periphery of the upper insulating film, a lower chip defining a chip mounting area in at least a part of a principal surface, the principal surface is facing to the upper insulating film, and a lower sealing-pattern disposed on the prin...