ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,427, issued on May 13, was assigned to THE UNIVERSITY OF TOKYO (Japan).
"System-on-chip with a plurality of chips communicating wirelessly using horizontal inductive coupling" was invented by Hidetsugu Irie (Tokyo), Junichiro Kadomoto (Tokyo) and Shuichi Sakai (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An information processing device is provided that can more flexibly adapt to changes in shape and mounting configuration. The information processing device has a plurality of chips that are integrated in the horizontal direction. A transmission coil and reception coil pair is formed in each of the plurality of chips, and each of the plurali...