US Patent Issued to THE UNIVERSITY OF HONG KONG on Feb. 25 for "Dynamic urea bond-based passivators of perovskite" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,238,945, issued on Feb. 25, was assigned to THE UNIVERSITY OF HONG KONG (Hong Kong, Hong Kong).

"Dynamic urea bond-based passivators of perovskite" was invented by Shien Ping Feng (Hong Kong, Hong Kong) and Wei Ting Wang (Hong Kong, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a passivated perovskite structure containing a perovskite layer; and a hindered urea bond-based Lewis acid-base containing layer adjacent the perovskite layer. Also disclosed are solar cells containing the passivated perovskite structure."

The patent was filed on Jan. 27, 2022, under Application No. 18/272,356.

*For further information, including images,...