US Patent Issued to The School Corporation Kansai University, Osaka Soda on Jan. 27 for "Electrically conductive adhesive, sintered body of electrically conductive adhesive, method for producing sintered body, electronic component, and method for producing electronic component" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,651, issued on Jan. 27, was assigned to The School Corporation Kansai University (Suita, Japan) and Osaka Soda Co. Ltd. (Osaka, Japan).

"Electrically conductive adhesive, sintered body of electrically conductive adhesive, method for producing sintered body, electronic component, and method for producing electronic component" was invented by Hideya Kawasaki (Suita, Japan), Suguru Hashidate (Osaka, Japan), Ryo Katou (Osaka, Japan), Takamichi Mori (Osaka, Japan) and Junichiro Minami (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a novel electrically conductive adhesive which can yield a sintered body having low resistivity des...