ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,466,137, issued on Nov. 11, was assigned to The Procter & Gamble Co. (Cincinnati).
"Method and apparatus for bonding substrates" was invented by Uwe Schneider (Cincinnati).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to methods for bonding first and second substrates together with tackifier free adhesives. The tackifier free adhesive may be applied to the second substrate to define an adherence zone. The first substrate is positioned on the adherence zone of the second substrate to define a first region and a second region of the adherence zone. In the first region, the tackifier free adhesive is positioned between the fi...