ALEXANDRIA, Va., June 16 -- United States Patent no. D1,076,074, issued on May 20, was assigned to The Procter & Gamble Co. (Cincinnati).
"Bond pattern for substrate" was invented by Ray Dennis Dria (Mason, Ohio), Michael Joseph Page (Cincinnati), Joseph Leslie Grolmes (Madeira, Ohio), Scott Alan King (Liberty Township, Ohio), Matthew Steven Ritter (Liberty Township, Ohio) and Christopher Colin Arp (Mason, Ohio).
The patent was filed on April 18, 2024, under Application No. D/938,093.
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Discla...