US Patent Issued to The Johns Hopkins University on June 3 for "Microcapsules for use with polyurethane and epoxy adhesives" (Maryland Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,318,748, issued on June 3, was assigned to The Johns Hopkins University (Baltimore).

"Microcapsules for use with polyurethane and epoxy adhesives" was invented by Christopher M. Hoffman Jr. (Odenton, Md.), Brian M. Koronkiewicz (Pasadena, Md.), Reid E. Messersmith (Severna Park, Md.) and Mairead E. Bartlett (Takoma Park, Md.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microcapsule for use with an underwater adhesive includes a shell including nanoclay platelets and a polyurea product of an interfacial polymerization of a polyamine and an aromatic polyisocyanate. The microcapsule further includes a core composition encapsulated by the shell. The core...