US Patent Issued to The Johns Hopkins University on Aug. 5 for "Large area scalable fabrication methodologies for versatile thermoelectric device modules" (North Carolina Inventor)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,830, issued on Aug. 5, was assigned to The Johns Hopkins University (Baltimore).

"Large area scalable fabrication methodologies for versatile thermoelectric device modules" was invented by Rama Venkatasubramanian (Cary, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems, apparatuses, and methods are provided for scalable manufacturing of thermoelectric device modules for multiple uses on a single substrate. An example method can include disposing thermoelectric structures on a substrate, the substrate having a first substrate material, and the thermoelectric structures having a thermoelectric material disposed on a second substrate material....