US Patent Issued to THE INDUSTRY & ACADEMIC COOPERPATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC) on Jan. 27 for "Method of manufacturing ultra-thin antireflection sticker and ultra-thin antireflection sticker" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,643, issued on Jan. 27, was assigned to THE INDUSTRY & ACADEMIC COOPERPATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC) (Daejeon, South Korea).

"Method of manufacturing ultra-thin antireflection sticker and ultra-thin antireflection sticker" was invented by Seong Min Kang (Gwangmyeong-si, South Korea) and Ji Seong Choi (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a monolayer-structured ultra-thin antireflection sticker through a soft lithography process and an ultra-thin antireflection sticker, includes: a master mold manufacturing step in which a master mold having a plurality of semi-spherical mold stru...