US Patent Issued to The Hong Kong University of Science and Technology on Dec. 2 for "Kirigami enabled method for fabrication of large-format electronic device arrays" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,385, issued on Dec. 2, was assigned to The Hong Kong University of Science and Technology (Hong Kong).

"Kirigami enabled method for fabrication of large-format electronic device arrays" was invented by Hongyu Yu (Hong Kong) and Ruoqin Wang (Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "A kirigami enabled manufacturing method and systems are provided. The method includes providing a plurality of substrate units for mounting electronic devices in an initial state; providing at least one connector connecting adjacent substrate units of the plurality of substrate units in the initial state, wherein the at least one connector includes one or mo...