US Patent Issued to The Hong Kong Polytechnic University on June 17 for "Perovskite with modified surface and method for making the same" (Chinese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,364, issued on June 17, was assigned to The Hong Kong Polytechnic University (Hong Kong).

"Perovskite with modified surface and method for making the same" was invented by Feng Yan (Hong Kong) and Jing Zhuang (Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "This invention provides a perovskite with a modified surface and method for making the same. In one embodiment, said perovskite is a mixed-cation lead halide perovskite; and said modified surface comprises a DPGABr:PbI2 complex layer. In one embodiment, said method for manufacturing a perovskite with a modified surface, comprises the steps of: a) Providing a perovskite with a surface to ...