US Patent Issued to The Boeing on Oct. 7 for "Methods for joining a first thermoplastic substrate with a second thermoplastic substrate" (Missouri Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,434,445, issued on Oct. 7, was assigned to The Boeing Co. (Arlington, Va.).

"Methods for joining a first thermoplastic substrate with a second thermoplastic substrate" was invented by Ying Shi (Saint Louis, Mo.), Alexander M. Rubin (St. Louis) and Gregory J. Hickman (University City, Mo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for joining a first thermoplastic substrate and a second thermoplastic substrate, each including a polyaryletherketone material having a first melting temperature. The method includes co-consolidating a first semicrystalline thermoplastic film with the first thermoplastic substrate to yield a first co-consolidated s...