ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,650, issued on Nov. 18, was assigned to The Boeing Co. (Arlington, Va.).
"Electroless plating systems and methods" was invented by Brian R. Nelson (St. Charles, Mo.) and Vance N. Petitt (St. Louis).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electroless plating system including an electroless plating solution, a recirculation subsystem and a replenishment subsystem, wherein the electroless plating solution is recirculated and replenished."
The patent was filed on July 3, 2024, under Application No. 18/762,931.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect...