US Patent Issued to The Boeing on March 18 for "Integrated phased array (IPA) thermal subsystem fluid loop simulator" (Illinois Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,253,439, issued on March 18, was assigned to The Boeing Co. (Chicago).

"Integrated phased array (IPA) thermal subsystem fluid loop simulator" was invented by Creed Reilly (Chicago), Gregory Kim (Chicago), Jimmy Huynh (Chicago) and Kevin Nemeth (Chicago).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application relates to systems, methods, and apparatus for facilitating the testing of a payload. An exemplary apparatus may include a fluid inlet port configured to receive fluid from a thermal subsystem of the payload. The apparatus may also include an actuating device configure to supply the fluid to a heat exchanger. A valve may be configured...