US Patent Issued to The Boeing on March 11 for "Electron beam lithography with a bilayer resist" (California Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,248,248, issued on March 11, was assigned to The Boeing Co. (Chicago).

"Electron beam lithography with a bilayer resist" was invented by Antonio Mei (Malibu, Calif.), Ivan Milosavljevic (Thousand Oaks, Calif.) and Amanda Simpson (Thousand Oaks, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method, apparatus, and system for processing a material stack. A hydrogen silsesquioxane layer is deposited on the material stack. A diffusion barrier layer is deposited on the hydrogen silsesquioxane layer to form a bilayer. The diffusion barrier layer comprises a material having a thickness that increases an amount of time before the hydrogen silsesquioxa...