US Patent Issued to The Boeing on Jan. 13 for "Bond assembly jig preparation methods using thermosetting bismaleimide resins" (Missouri Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,946, issued on Jan. 13, was assigned to The Boeing Co. (Arlington, Va.).

"Bond assembly jig preparation methods using thermosetting bismaleimide resins" was invented by George E. Bible (Chesterfield, Mo.) and Peter M. Winzek (Clayton, Mo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for preparing a bond assembly jig (BAJ) includes forming a cutter relief groove in the BAJ, filling the cutter relief groove of the BAJ with a material, and curing the material after said filling."

The patent was filed on Dec. 6, 2023, under Application No. 18/530,646.

*For further information, including images, charts and tables, please visit: http://patft....