ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,212, issued on April 15, was assigned to The Boeing Co. (Arlington, Va.).
"Reworkable inter-substrate bond structure" was invented by Peter D. Brewer (Westlake Village, Calif.), John J. Vajo (West Hills, Calif.), Sevag Terterian (Lake Balboa, Calif.), Chia-Ming Chang (Agoura Hills, Calif.), Charbel Abijaoude (Newbury Park, Calif.) and Diego Eduardo Carrasco (Los Angeles).
According to the abstract* released by the U.S. Patent & Trademark Office: "An inter-substrate bond structure includes an adhesion layer that attached to a first substrate, and an outer gas-permeable layer coupled to the adhesion layer. The outer gas-permeable layer expands and fractures in response to absorbing ...