US Patent Issued to The 13th Research Institute of China Electronics Technology Group on Dec. 9 for "Multi-surface airtight packaging ceramic shell, multi-surface packaging device and preparation method" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,377, issued on Dec. 9, was assigned to The 13th Research Institute of China Electronics Technology Group Corp. (Shijiazhuang, China).

"Multi-surface airtight packaging ceramic shell, multi-surface packaging device and preparation method" was invented by Fei Yu (Shijiazhuang, China), Zhentao Yang (Shijiazhuang, China), Ximeng Yu (Shijiazhuang, China), Jiangtao Chen (Shijiazhuang, China) and Linjie Liu (Shijiazhuang, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application provides a multi-surface airtight packaging ceramic shell, a multi-surface packaging device, and preparation method, belonging to the field of ceramic packaging t...