US Patent Issued to TEXAS INSTRUMENTS on Sept. 9 for "Power module with multi-layer substrate and second insulation layer to increase power density" (California Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,840, issued on Sept. 9, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Power module with multi-layer substrate and second insulation layer to increase power density" was invented by Kwnag-Soo Kim (Sunnyvale, Calif.), Vivek Kishorechand Arora (San Jose, Calif.) and Woochan Kim (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An example semiconductor package comprises a multi-layer substrate having a bottom metal layer, a top metal layer, and a first insulation layer between bottom metal layer and the top metal layer. A plurality of first conductive traces are formed in the top metal layer. A second insulation layer is disposed ove...