US Patent Issued to TEXAS INSTRUMENTS on Sept. 9 for "Integrated circuit package having enhanced thermal dissipation structure" (Texas Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,800, issued on Sept. 9, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Integrated circuit package having enhanced thermal dissipation structure" was invented by Manu Joseph Prakuzhy (Allen, Texas), Siva Prakash Gurrum (Allen, Texas) and Blake Barrett Travis (Richardson, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes an electrically conductive connector and a die that has an active side and a non-active side. The active side of the die is connected to the electrically conductive connector via interconnects. A molding compound encaps...