US Patent Issued to TEXAS INSTRUMENTS on Sept. 9 for "Dual down-set conductive terminals for externally mounted passive components" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,795, issued on Sept. 9, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Dual down-set conductive terminals for externally mounted passive components" was invented by Masamitsu Matsuura (Beppu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some examples, a semiconductor package comprises a first die pad having a first top surface and a first bottom surface opposing the first top surface and a second die pad in horizontal alignment with the first die pad, the second die pad having a second top surface and a second bottom surface opposing the second top surface, a gap separating the first and second die pads. The package comprises a semico...