US Patent Issued to TEXAS INSTRUMENTS on Sept. 23 for "Semiconductor device package with internal magnetic shield for hall sensor" (American, Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,459, issued on Sept. 23, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Semiconductor device package with internal magnetic shield for hall sensor" was invented by Yi Yan (San Jose, Calif.), Dok Won Lee (Mountain View, Calif.), Hank Ming Sung (Sachse, Texas) and Kenji Otake (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A described example includes: a heat slug coupled to a package substrate, the heat slug configured to conduct a current between terminals of the package substrate; a first magnetic shield mounted to a top surface of the package substrate, the first magnetic shield including a die mount area; a semiconductor die fli...