ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,097, issued on Sept. 16, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Microelectronic device package including antenna and semiconductor device" was invented by Yiqi Tang (Allen, Texas), Rajen Manicon Murugan (Dallas) and Juan Alejandro Herbsommer (Allen, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A described example includes an antenna formed in a first conductor layer on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers, the multilayer package substrate...