US Patent Issued to TEXAS INSTRUMENTS on Sept. 16 for "Interconnect for IC package" (Philippine Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,965, issued on Sept. 16, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Interconnect for IC package" was invented by Ruby Ann Merto Camenforte (Mabalacat, Philippines), Floro Lopez Camenforte (Mabalacat, Philippines) and Dolores Babaran Milo (Baguio, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) package includes an interconnect comprising patches of unoxidized metal that are circumscribed by a region of roughened metal formed of oxidized metal. The IC package also includes a die mounted on the interconnect. The die is conductively coupled to at least a subset of the patches of unoxidized metal."

The paten...