ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,419,063, issued on Sept. 16, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Inductor on microelectronic die" was invented by Sreenivasan K Koduri (Dallas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic device has bump bonds and an inductor on a die. The microelectronic device includes first lateral conductors extending along a terminal surface of the die, wherein at least some of the first lateral conductors contact at least some of terminals of the die. The microelectronic device also includes conductive columns on the first lateral conductors, extending perpendicularly from the terminal surface, and second lateral conductors on th...