US Patent Issued to TEXAS INSTRUMENTS on Oct. 7 for "Multilayer package substrate with stress buffer" (Texas Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,072, issued on Oct. 7, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Multilayer package substrate with stress buffer" was invented by Guangxu Li (Allen, Texas), Yiqi Tang (Allen, Texas) and Rajen Manicon Murugan (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a multilayer package substrate including a top layer including a top dielectric layer and a top metal layer providing a top portion of pins on top filled vias, and a bottom layer including a bottom dielectric layer and a bottom metal layer on bottom filled vias that provide externally accessible bottom side contact pads. The top dielectric layer togeth...