US Patent Issued to TEXAS INSTRUMENTS on Oct. 28 for "3D printed semiconductor package" (California, Texas Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,457,756, issued on Oct. 28, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"3D printed semiconductor package" was invented by Benjamin Stassen Cook (Los Gatos, Calif.) and Daniel Lee Revier (Garland, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "In described examples, an integrated circuit comprises: a substrate; a semiconductor die on the substrate; and a device on the substrate and electrically coupled to the semiconductor die, the device including a polymer structure coated with a metal."

The patent was filed on Jan. 4, 2024, under Application No. 18/404,496.

*For further information, including images, charts and tables, please visit: http...