US Patent Issued to TEXAS INSTRUMENTS on Oct. 14 for "Flip-chip enhanced quad flat no-lead electronic device with conductor backed coplanar waveguide transmission line feed in multilevel package substrate" (Texas Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,702, issued on Oct. 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Flip-chip enhanced quad flat no-lead electronic device with conductor backed coplanar waveguide transmission line feed in multilevel package substrate" was invented by Rajen Manicon Murugan (Dallas) and Yiqi Tang (Allen, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a multilevel package substrate with first, second, third, and fourth levels, a semiconductor die mounted to the first level, and a conductor backed coplanar waveguide transmission line feed with an interconnect and a conductor, the interconnect including coplanar first, second, ...