ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,148, issued on Nov. 4, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"3D stacked die test architecture" was invented by Lee D. Whetsel (Parker, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die."
The patent was filed on June 5, 2024, under Application No. 18/734,226.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=...