ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,718, issued on Nov. 25, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Thermally enhanced embedded die package" was invented by Woochan Kim (San Jose, Calif.), Kwang-Soo Kim (Sunnyvale, Calif.) and Vivek Arora (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes an embedded die frame having a cavity and a routing structure, a semiconductor die in the cavity with a gallium nitride layer on the routing structure, and a heat spreader having a thermally conductive insulator layer and a metal plate, the thermally conductive insulator layer having a first side that faces the embedded die frame and an opposite s...