US Patent Issued to TEXAS INSTRUMENTS on Nov. 25 for "Selective plating for packaged semiconductor devices" (American, Philippine Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,769, issued on Nov. 25, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Selective plating for packaged semiconductor devices" was invented by Katleen Fajardo Timbol (Allen, Texas) and Jeffrey Salvacion Solas (Angeles, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "A described example includes: a semiconductor die having a device side surface and an opposing backside surface, the backside surface mounted to a die pad of a lead frame, the lead frame comprising conductive leads spaced from the die pad; a conductor layer overlying the device side surface; bond pads including bond pad conductors formed in the conductor layer, a nickel layer...