US Patent Issued to TEXAS INSTRUMENTS on Nov. 18 for "High voltage flip-chip on lead (FOL) package" (California, Texas Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,170, issued on Nov. 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"High voltage flip-chip on lead (FOL) package" was invented by Anindya Poddar (Sunnyvale, Calif.), Thomas Dyer Bonifield (Dallas), Woochan Kim (Sunnyvale, Calif.) and Vivek Kishorechand Arora (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein is a technology or a method for fabricating a flip-chip on lead (FOL) semiconductor package. A lead frame includes an edge on surface that has a geometric shape that provides a radial and uniform distribution of electric fields. By placing the formed geometric shape along an active die of a semiconductor chip...