US Patent Issued to TEXAS INSTRUMENTS on Nov. 18 for "Electronic device with post mold plated nickel tungsten and tin bilayer for improved board level reliability" (California Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,173, issued on Nov. 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Electronic device with post mold plated nickel tungsten and tin bilayer for improved board level reliability" was invented by Nazila Dadvand (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a semiconductor die, a package structure enclosing the semiconductor die, and a conductive lead having first and second surfaces. The first surface has a bilayer exposed along a side of the package structure, and the second surface is exposed along another side of the package structure. The bilayer includes first and second plated layers, the...