US Patent Issued to TEXAS INSTRUMENTS on Nov. 11 for "Die attach film die pad isolation for semiconductor devices" (Philippine Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,772, issued on Nov. 11, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Die attach film die pad isolation for semiconductor devices" was invented by Jesus Bajo Bautista Jr. (Baguio City, Philippines), Jeniffer Otero Aspuria (Baguio City, Philippines), Jezreel Duane Caluza Aquino (Baguio City, Philippines) and Francis Masiglat de Vera (Baguio City, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a described example, an apparatus includes: a semiconductor die having a device side surface and an opposing backside surface, the backside surface mounted to a die pad of a lead frame using a die attach film; bond pads overlying the device si...